Analysis On Current Situation, Trends And Market Prospects Of Electronic-Grade Fiberglass Cloth Industry
I. Industry Current Situation: AI Restructures Supply and Demand, High-end Products Achieve Rising Volume and Price
Rapid Growth of Market ScaleThe global electronic fiberglass fabric market reached approximately 8.6 billion U.S. dollars in 2024 and is projected to hit 18.2 billion U.S. dollars by 2030, with a CAGR of 13.5% from 2024 to 2030. The domestic market is expanding simultaneously, with a scale approaching 30 billion RMB in 2025, and high-end products accounting for over 40%.
Tight Supply-demand Pattern and Sustained Price IncreaseDriven by surging demand for AI servers and high-speed switches, high-end electronic fiberglass fabrics (1080, 2116, 7628) are in structural shortage.The price of standard 7628 electronic fabric rose from 4.15 RMB per meter in September 2025 to 6.5 RMB per meter in April 2026, representing an increase of over 56.6%. Thin and ultra-thin fabrics saw even larger gains, with inventory measured on a weekly basis.
Competitive Landscape: Rise of Domestic Leaders and Higher Global ConcentrationThe top five global manufacturers occupy a combined market share of 68.5%.China Jushi (the world's largest production capacity, 1.2 billion meters per year, 28% market share), Honghe Technology (leader in ultra-thin fabric) and Sinoma Technology (special electronic fabric) lead domestic substitution.In March 2026, China Jushi launched the world's largest electronic fabric production line in Huai'an with an annual capacity of 390 million meters, further consolidating its leading position.
II. Industry Trends: Three Main Directions - High-end, Ultra-thin and Green
Product Upgrading: Transition to Low-Dk, Low-CTE and Quartz Fabric (Q-Cloth)
Ultra-thinning: 9μm / 4μm ultra-thin fabrics break technical monopolies to match AI packaging substrates.
Low dielectric constant (Low-Dk): Reduces signal loss and becomes the standard configuration for high-speed communication and AI servers.
Low coefficient of thermal expansion (Low-CTE): Adapted to advanced Chiplet packaging.
Quartz fabric (Q-Cloth): The optimal solution for ultra-high frequency scenarios; a single NVIDIA GB300 unit consumes 18–24 meters.
Golden Period for Domestic SubstitutionHigh-end imported electronic fabrics suffer from high prices and unstable supply.Leading domestic enterprises have broken through core technologies and obtained certifications from NVIDIA and TSMC.Supported by national policies during the 15th Five-Year Plan period, 2026–2028 will be a critical window for domestic substitution.
Green & Intelligent Manufacturing Becomes StandardChina Jushi's Huai'an base realizes 100% green power coverage with an annual carbon emission reduction of 400,000 tons.The industry is shifting toward zero carbon, intelligence and high efficiency to strengthen overall competitiveness.
III. Market Prospects: Long-term High Prosperity with Three Core Growth Drivers
1.AI Computing Revolution (Core Driver)
High-end AI servers adopt 7–8 layer PCBs, consuming 5 to 8 times more electronic fabric than ordinary servers.Continuous investment in computing infrastructure will drive long-term robust demand growth.
2.New Energy & Automotive Electronics (Stable Increment)
The upgrading of electronic and electrical architectures in new energy vehicles has boosted PCB consumption by more than 30%.Photovoltaic and wind power industries also drive rising demand for high-modulus fiberglass fabrics.
3.6G & Advanced Packaging (Future Growth Pole)
6G technology brings explosive demand for high-frequency and high-speed materials, fueling an annual growth of over 15% for Low-Dk fabrics and quartz fabrics.Advanced packaging technologies including Chiplet, 2.5D and 3D packaging continuously raise requirements for ultra-thin and low-CTE electronic fabrics.
The electronic fiberglass fabric industry is witnessing triple favorable factors: cyclical recovery, technological upgrading and domestic substitution. It has evolved from a traditional basic material into a core track for AI computing.In the short term, tight supply and demand will keep product prices at a high level. In the long run, high-end iteration and localized substitution will unlock lasting growth potential.From 2026 to 2030, leading enterprises with advantages in technology, production capacity and cost will dominate the market and fully benefit from the industry expansion dividend.
