Did you know that Nippon Electric Glass has launched low-dielectric fiberglass?
On December 2, 2025, NEC Glass (NEG) announced the official launch of its low-dielectric fiberglass, "D2Fiber." This fiber, used in AI server motherboards, high-frequency communication equipment substrates, and semiconductor packaging substrates, effectively suppresses signal transmission loss.
The most significant feature of D2Fiber is its extremely low dielectric loss (tanδ=0.0017). In comparison, NEG's existing product, "E-fiberglass," has a dielectric loss of 0.0065. Through techniques such as adjusting the glass composition, D2Fiber achieves a dielectric loss far lower than E-fiberglass, thereby reducing signal transmission loss and supporting high-speed, high-capacity communication. Simultaneously, the reduced communication loss decreases heat generation caused by losses, contributing to lower energy consumption in cooling systems.
With the explosive growth of generative AI, the volume of communication data is expected to continue to increase rapidly. Therefore, substrate materials used in servers, communication equipment, and semiconductor packaging urgently require materials with lower transmission loss. NEG stated that D2Fiber is a product born out of strong market demand.
More than a decade ago, NEG also developed low-dielectric fiberglass for motherboards, but production was halted at one point because resources were concentrated on automotive-grade E-fiberglass. "This time, due to very strong market demand, we restarted development and finally launched the D-series fiberglass," the company stated. "In the future, we also hope to further expand the proportion of high-value-added products in the field of fiberglass and other glass composite materials."
