Comparison Of Product Parameters And Applicable Fields For E-fiberglass, Low-Dk Fiberglass, And Quartz Fiber.
I. Comparison and Analysis of Composition and Raw Materials
E-Fiberglass (For General Electronic Cloth)
- Composition: SiO₂ approximately 52%~56%, containing various metal oxides such as boron, aluminum, calcium, and magnesium
- Purity: Ordinary industrial grade, relatively high impurities
- Raw Materials: Ordinary glass beads, pyrophyllite, etc.
- Positioning: General-purpose basic fiberglass
Low-Dk Fiberglass (Low Dielectric Electronic Cloth)
- Composition: Increased SiO₂, reduced boron/alkali metal content, modified formula
- Purity: Medium, targeted reduction of dielectric-related impurities
- Raw Materials: Modified glass material, specialized formula
- Positioning: Dedicated for mid-to-high-end high-speed PCBs
Quartz Fiber (For Q Cloth)
- Composition: SiO₂ ≥99.95%~99.998%, almost pure silicon dioxide
- Purity: Ultra-high purity, alkali metal <10ppm
- Raw Materials: High-purity quartz sand/crystal material
- Positioning: High-end ultra-low dielectric, high-temperature resistant specialty materials
II. Application Area Analysis
- E-glass fiber: Used in ordinary household appliances, consumer electronics, conventional PCBs, and 7628/2116/1080 standard electronic cloths; the top choice for cost-effectiveness.
- Low-Dk glass fiber: Used in mid-to-high-end servers, 5G base stations, automotive high-speed PCBs, and scenarios with certain signal requirements.
- Quartz fiber (Q cloth): Used in AI servers (GB200, etc.), 1.6T/800G optical modules, 6G/millimeter wave, radar, satellite communication, high-end chip carriers, and aerospace wave-transparent materials.
III. Cost and Process Difficulty
- E-glass fiber: Mature process, low cost, and extremely high production capacity.
- Low-Dk glass fiber: Relatively complex process, medium to high cost.
- Quartz fiber: Extremely pure raw materials, high-temperature drawing above 2000℃, extremely difficult, and cost far higher than the former two.
